91猫先生

一、 演講主題：「Preparation and Dispersion of Cu Nanoparticles for Semiconductor Packaging」
二、 主講人：Prof. Tetsu Yonezawa (米澤 徹 教授)
日本北海道大學 材料科學部門 教授
三、 摘要：
Copper nanoparticles are promising for next-gen interconnects due to high conductivity and low-cost processing. However, oxidation under ambient conditions limits their performance. We present oxidation-tolerant core–shell Cu nanoparticles with Cu64O/Cu8O-rich surfaces, enabling thermal stability and sinterability. Using sugar alcohol-based solvents, we formulate >80 wt% copper pastes with excellent dispersion and film-forming properties. Thermal analysis, in situ XRD, and sintering studies show strong bonding and conductivity below 200°C under reducing/inert atmospheres. This approach suits 3D integration, power devices, and flexible electronics, offering a practical route for copper nanoparticle use in semiconductor packaging with enhanced reliability and low-temperature processing.
四、演講關鍵詞：Copper nanoparticles, Low-temperature sintering, Oxidation control, Electronic packaging, High-concentration paste
五、 日期：2025/10/15(三) 14:30~16:00
六、 地點: 工學大樓1樓工学院第一會議室
七、 報名截止日：10/14(二)
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注意事项：
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公告单位：研发处永续发展与能源科技研究中心-校外经费
承办人：邱姿萤

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