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Tsai, M. Y., Oplinger, D. W. and Morton, J., "Improved Theoretical Solutions of Adhesive Joints, " Int. J. Solids and Structures, Vol. 35, No. 12, pp.1163-1185, 1998. (Citation=490)
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Tsai, M. Y. and Morton, J., "An Evaluation of Analytical and Numerical Solutions to the Single-lap Joint," Int. J. Solid and Structures Vol. 31, No. 18, pp.2537-2563, 1994. (Citation=278)
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Tsai, M. Y. and Morton, J., "The Effect of a Spew Fillet on Adhesive Stress Distributions in Laminated Composite Single-Lap Joints," Composite Structures, Vol. 32, pp.123-131, 1995. (Citation=263)
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Tsai, M. Y., Hsu, C. H. and Wang, C. T., “Investigation of Thermomechanical Behaviors of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling,” IEEE Transactions on Components and Packaging Technologies Vol. 27, No. 3, pp.568-576, 2004. (Citation=125)
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Tsai, M. Y., Hsu, C. H. and Han, C. N., “A Note on Suhir’s Solution of Thermal Stresses a Die-Substrate Assembly, “Transaction of ASME, J. of Electronic Packaging, Vol. 126, pp.115-119, March 2004. (Citation=101)
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M. Y. Tsai and P. S. Huang, “Correction Factors to Strength of Thin Silicon Die in Three- and Four-Point Bending Tests Due to Nonlinear Effects,” Microelectronics Reliability, 128,114424, 2022, DOI: .
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M. Y. Tsai and H. Y. Liu, “Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test,” ASME, Journal of Electronic Packaging, Vol. 144, pp. 031002-1~11, Sept. 2022, DOI: .
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M.C. Liao, P.S. Huang, T. C. Huang, and M.Y. Tsai “Backplate-Reinforced Structures for Enhancing Solder Joint Reliability of Server CPU Assembly Under Thermal Cycling,” J. of Mechanics, No. 37, pp. 693–703, 2021, DOI: .
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M. Y. Tsai, Y. W. Wang and C. M. Liu, “Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges,” Materials, 14, 3723, pp.1-19, July 2021, DOI: .
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M. Y. Tsai, J. H. Yeh, P. S. Huang, D. L. Chen, M. K. Shih, and David Tarng, “Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the PoEF Test,” IEEE Transactions on Device and Materials Reliability, vol. 20, No.2, pp.442-451, June 2020, DOI: .
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M. Y. Tsai, P. S. Huang, J. H. Yeh, H. Y. Liu, Y. C. Chao, Fila Tsai, D. L. Chen, M. K. Shih, and David Tarng, “Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity,” IEEE Transactions on Device and Materials Reliability, vol. 19, No. 4, pp. 615-621, Dec. 2019, DOI: .
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M. Y. Tsai, H. J. Chen, and J. H. Yeh, “Evaluation of Bending Strength of Window Glass Substrate with Considerations of Uni- and Bi-axial Loading, and Free Edge Stresses,” ASME, Journal of Electronic Packaging, Vol. 141, pp. 041007-1~7, Dec. 2019, DOI: .
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M. Y. Tsai, G. M. Liu, Y. W. Wang, and H. Y. Liu, “Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies,” IEEE Transactions on Device and Materials Reliability, Vol.18, No.3, pp. 450-455, Sept. 2018, DOI: .
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Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Ming-Yi Tsai*, Chen-Yu Huang, and Te-Chin Huang, “Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges,” Applied Sciences-Basel, vol. 7, pp 739-750, July 2017, DOI: .
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M. Y. Tsai, H. Y. Liu, G. M. Liu, H. L. Chen, and C. Y. Huang, “Strength Evaluation of Si Interposers by PoEF Test Associated with Acoustic Emission Method,” IEEE Transactions on Device and Materials Reliability, Vol. 7, No. 2, pp. 364-370, June 2017, DOI: .
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M. Y. Tsai, C. Y. Tang, C. E. Zheng, Y. Y. Tsai and C. H. Chen, “Thermal Analyses of LED Light Bars and Backlight Modules,” J. of Mechanics, Vol. 33, No. 3, pp.331-339, June 2017, DOI: .
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